We are pleased to invite you to visit BizLink at OCP APAC 2025. Our exhibit will feature high-performance interconnect and power solutions built on the BG-300 rack system, engineered to optimize integration and scalability for next-generation data centers.
Featured Highlights
1.6T High Speed Connectivity Solutions
Optimized for next-generation data center connectivity, BizLink’s high-speed interconnect solutions deliver 1.6T transmission with strong signal integrity and thermal performance to enable scalable data processing in next-generation data center environments.
PCIe Gen6 High Speed Solutions
Developed to support high-speed signal transmission in AI and HPC systems, BizLink’s PCIe Gen6 solutions enable data rates up to 64Gbps per lane. These solutions are designed to ensure signal integrity and system stability for next-generation data center deployments.
OCP ORV3 Power Solutions
Developed for high-density ORV3 racks and power equipment, BizLink’s AC/DC power and busbar solutions support up to 140kW per rack and 33kW per power shelf, enabling efficient power delivery for next-generation data centers.
Multi-Fiber Optical Interconnect Solutions
Designed for high-density fiber deployment, BizLink’s multi-fiber optical solutions simplify installation, improve throughput and space efficiency, and enhance network scalability for next-generation data centers.
Why Choose BizLink for Scalable AI and Data Center Infrastructure?
BizLink is trusted by global leaders to advance AI and HPC infrastructure. With deep technical expertise and a global support network, we deliver high-performance solutions developed for your deployment needs.
✔ Data Center Integration Expertise
BizLink enables system-level integration through scalable interconnect and power solutions for AI and HPC data center deployments.
✔ Next-Gen Interconnect Performance
BizLink’s PCIe Gen6 solutions deliver signal integrity, thermal efficiency, and reliable performance for AI and HPC applications.
✔ Proven ORV3 Power Architecture
BizLink’s AC/DC and busbar solutions are engineered to support up to 140kW per rack and 33kW per power shelf, enabling efficient power delivery for next-generation data centers.
✔ Space-Efficient Optical Solutions
BizLink supports Co-Packaged Optics (CPO) and silicon photonics connectivity with multi-fiber deployments that optimize space and enable flexible, high-efficiency networks for next-generation data centers.
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